Applications for HVTWF are now closed. Learn more about our summer program here.

Harvard Ventures-TECH Winter Fellowship

The application form for the Harvard Ventures-TECH Winter Fellowship (HVTWF) can be found below. Admissions will be conducted on a rolling basis with applications due on 11/30/2024. Prospective students will be evaluated based on scholarly merit and their demonstrated interest in both HVTWF and in gaining hands-on experience in their field of choice.

The Harvard Ventures-TECH Winter Fellowship (HVTWF) is supported by the Technology and Entrepreneurship Center at Harvard (TECH) within Harvard University’s School of Engineering and Applied Sciences (SEAS). HVTWF is also supported by Harvard College Ventures, the largest student-run entrepreneurship and venture capital organization at Harvard. We are extremely grateful for our participating startups, world-class speakers, and corporate sponsors which have allowed us to make this program happen.

Terms and Conditions: By applying to the Harvard Ventures-TECH Winter Fellowship (HVTWF), applicants acknowledge that submitting an application is a request for consideration and does not ensure admission into the program. The program’s offerings, including speakers and events, are subject to change depending on their availability and evolving circumstances. Successful completion of the program is contingent upon students meeting predetermined performance standards, and HVTWF makes no guarantees regarding specific results or achievements. Participation in HVTWF implies a commitment to fully engage in the learning experience and an acceptance of these terms. Harvard Ventures-TECH Winter Fellowship (HVTWF) is entitled to and may use third-party vendors to administer and deliver the program. Applicants agree that their contact information may be used to send newsletters, promotional materials, and marketing communications regarding TECH and non-TECH programs, products, services, and events. Applicants may opt out of such marketing communications at any time.